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Translate missing messages part y

This commit is contained in:
3d-gussner 2023-03-10 09:57:07 +01:00
parent 5582fbf71e
commit 79a2bbf86b
13 changed files with 15 additions and 15 deletions
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6
lang/po/Firmware_cs.po
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@ -2511,7 +2511,7 @@ msgstr "MCU PODPĚTÍ VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Výměn materiálů"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318
@ -2603,8 +2603,8 @@ msgstr ""
#~ msgid "MK3 firmware detected on MK3S printer"
#~ msgstr "MK3 firmware detekovan na MK3S tiskarne"
#~ msgid "MK3S firmware detected on MK3 printer"
#~ msgstr "MK3S firmware detekovan na tiskarne MK3"
#msgid "MK3S firmware detected on MK3 printer"
#msgstr "MK3S firmware detekovan na tiskarne MK3"
#~ msgid "MMU OK. Resuming position..."
#~ msgstr "MMU OK. Pokracuji v tisku..."

2
lang/po/Firmware_de.po
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@ -2538,7 +2538,7 @@ msgstr "MCU-UNTERSPANN. VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Materialwechsel"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_es.po
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@ -2535,7 +2535,7 @@ msgstr "MCU BAJO VOLTAJE VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Cambios materiales"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_fr.po
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@ -2547,7 +2547,7 @@ msgstr "MCU SOUS-TENSION VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Changes matériels"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_hr.po
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@ -2528,7 +2528,7 @@ msgstr "MCU PODNAPON VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Materijal razmjene"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_hu.po
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@ -2533,7 +2533,7 @@ msgstr "MCU ALFESZÜLTSÉ. VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Anyagcserék"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_it.po
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@ -2534,7 +2534,7 @@ msgstr "SOTTOTENSION MCU VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Scambi materiali"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_nl.po
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@ -2537,7 +2537,7 @@ msgstr "MCU ONDERSPANN. VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Materailwisseling."
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_no.po
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@ -2510,7 +2510,7 @@ msgstr "MCU UNDERSPENN. VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Materialutveksling"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_pl.po
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@ -2529,7 +2529,7 @@ msgstr "MCU POD NAPIĘCI. VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Wymiany materiałów"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_ro.po
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@ -2533,7 +2533,7 @@ msgstr "MCU SUBTENSIUNE VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Schimburi material"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_sk.po
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@ -2517,7 +2517,7 @@ msgstr "MCU PODPÄŤOVÉ VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Výmen materiálov"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318

2
lang/po/Firmware_sv.po
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@ -2523,7 +2523,7 @@ msgstr "MCU UNDERSPÄNN. VCC"
#: ../../Firmware/messages.cpp:102 ../../Firmware/ultralcd.cpp:1121
#: ../../Firmware/ultralcd.cpp:1195
msgid "Material changes"
msgstr ""
msgstr "Materialutbyten"
#. MSG_DESC_FILAMENT_EJECTED c=20 r=8
#: ../../Firmware/mmu2/errors_list.h:265 ../../Firmware/mmu2/errors_list.h:318